Choosing good quality BGA reballing,it is high roundness,high purity,high accuracy,high brightness.Unit reballing diameter tolerance is minuteness and low oxygen.
Good conductive and welding performance , better heat dissipation, improving consumer electronic characteristics ,in which made packaging thinness, packaging area narrowness, binding points distance shortener.
no need bending pins, to improve product composition rate,It is a kind of high density surface assembly and packaging technology,in which satisfy with short, small, light and thin requirment.
ESD glass bottles packaging,improve storage rate
Application
It is mainly used for IC package specific materials, suitable for DIP SOJ SOP TSOP QFP BGA CSP and others craftwork
