138℃ low-temperature Lead-Free solder paste suitable for heat-sensitive element welding and low
temperatuer elecctronic compnent welding ,such as planting tin in the middle layer of mobile
Defect:soldering joint is non-solidness, easy happend false welding and back-repair possible
1.Relaxed reflow process window
2.Low bubble and void rate
3.transparent residue
4.Excellent wetting and tin eating ability
5.Can maintain long-term adhesion
6.Excellent printing performance and long stencil life
